The Electronic Industries Association of India (ELCINA) has lauded the Union Cabinet’s green light to four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), calling it a game-changing moment for India’s electronics ecosystem. With an investment outlay of nearly ₹4,600 crore, these projects span the states of Odisha, Punjab, and Andhra Pradesh, introducing India to advanced technologies such as silicon carbide (SiC) semiconductors, high-power discrete devices, and glass substrate packaging.
“These approvals represent a giant leap forward in India’s semiconductor journey,” said Sasikumar Gendham, President of ELCINA. “For the first time, we will see commercial production of compound semiconductors and advanced glass substrate packaging on Indian soil, reducing critical import dependencies. This will not only ease pressure on our electronics trade balance but also provide the backbone for strategic sectors like defence, EVs and renewable energy.”
The projects signal a shift in India’s semiconductor approach—moving beyond traditional silicon fabs to focus on high-growth, specialised domains. “With India now investing in technologies that go beyond conventional silicon, we are positioning ourselves not just as participants but as potential leaders in high-growth markets such as EV charging and high-performance computing,” Gendham added.
In Andhra Pradesh, ASIP Technologies—partnering with South Korea’s APACT—will set up a system-in-package (SiP) facility targeting mobile, consumer, and automotive electronics. Odisha will see SiCSem Pvt. Ltd, in collaboration with UK-based Clas-SiC Wafer Fab, establish the country’s first SiC fab. The state will also host a packaging unit from US-based 3D Glass Solutions, focused on technologies like 3D heterogeneous integration and glass interposers. Meanwhile, CDIL in Punjab will scale up discrete device production, including critical components for EVs and telecom.
ELCINA estimates the creation of over 2,000 direct jobs, alongside a ripple effect of indirect employment and ecosystem growth. “The Cabinet’s decision will accelerate the diversification and deepening of India’s semiconductor capabilities,” said Rajoo Goel, Secretary General, ELCINA. “Beyond silicon, the entry into SiC devices, advanced interposers and high-power discretes expands opportunities in EVs, defence, telecom and renewable energy.”
Goel also emphasised the need for skilled talent to support the manufacturing push. “Already over 60,000 students have been trained under ISM’s talent programmes, and we expect this number to grow rapidly, as these projects are near commissioning. Without the human capital, infrastructure alone cannot deliver results.”
The announcement is a major stride towards India’s goal of achieving $500 billion in electronics production by 2030. According to ELCINA, by targeting niche areas in compound semiconductors and packaging, India is carving out a competitive position in the global chip industry, instead of directly competing with established players like Taiwan or South Korea.
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