India’s semiconductor manufacturing ambitions received a major boost as Intel and 3DGS Inc. USA announced plans to invest approximately $3.3 billion in a new semiconductor substrate manufacturing facility in the eastern state of Odisha. The project marks another significant step in the country’s efforts to strengthen its position in the global semiconductor supply chain and expand domestic high-tech manufacturing capabilities.
The proposed facility will be established in the Bhubaneswar-Khurda region and is expected to be developed over a period of five to six years. Once operational, the plant will focus on the production of advanced packaging glass core substrates, high-density interconnect substrates, and other technologies critical to modern semiconductor manufacturing.
Substrates serve as the foundational platform on which semiconductor components are assembled, making them an essential part of the chip production process. Demand for advanced substrate technologies has increased globally as chipmakers seek higher performance, greater efficiency, and more sophisticated packaging solutions for next-generation electronics.
The project is expected to generate more than 1,800 direct high-skilled jobs, creating opportunities for engineers, researchers, technicians and other professionals in the semiconductor ecosystem. The investment is also likely to support the growth of ancillary industries and contribute to the development of a broader technology manufacturing network in the region.
The announcement aligns with the Indian government’s ongoing strategy to attract semiconductor and electronics manufacturing investments through financial incentives and policy support. In recent years, New Delhi has committed billions of dollars in subsidies aimed at encouraging global technology companies to establish manufacturing facilities within the country.
The investment reflects growing confidence in India’s semiconductor ambitions as the country works to reduce dependence on imports and position itself as a key destination for advanced technology manufacturing. By focusing on critical components used in chip production, the Odisha facility is expected to strengthen India’s participation in the global semiconductor value chain.
Industry observers view the project as an important milestone in the country’s efforts to build a self-reliant semiconductor ecosystem. The planned facility will not only enhance domestic manufacturing capabilities but also support India’s broader objective of becoming a significant player in the global electronics and semiconductor industry.
With substantial investment, advanced manufacturing technologies and the creation of highly skilled employment opportunities, the project is expected to contribute significantly to the growth of India’s technology sector in the coming years.
